
SimInsights is proud to present at the upcoming In Space Manufacturing Symposium in Austin, TX on June 11, 2025.
This year’s event will focus on “CHIPS in Space: An Alliance for Pioneering Space-Based Semiconductor Manufacturing to Advanced Science and Establish US Preeminence in Semiconductors.” Speakers will include Founder and CEO of SimInsights Rajesh Jha, Texas A&M Associate Vice Chancellor and Director, Semiconductor Institute, Steve Putna, Dr. Senesky of Stanford University, the Texas Space Commission Executive Director Norm Garza and world-renowned researchers.
Among the discussion topics are robotics, virtual reality and, of course, in space manufacturing.
Skills gap is a major challenge in advanced manufacturing and many other fields. High-quality training like generative AI technology offered by SimInsights can help address this critical gap.
About HyperSkill
HyperSkill is a no-code 3D simulation platform for both Virtual and Augmented Reality. HyperSkill was created to enable instructional designers to create immersive training content without having to learn programming. HyperSkill includes thousands of 3D assets and simulations that are accessible for free to users. HyperSkill enables non-programmers to author VR/AR content, publish it to various devices and audiences and collect and visualize experience data. HyperSkill has been developed with R&D funding from the National Science Foundation. To learn more, please visit https://siminsights.com/hyperskill/
About SimInsights
SimInsights mission is to democratize the creation of 3D, interactive, immersive and intelligent (I^3) simulations. We believe that simulations are the most impactful way to learn, yet few people can actually leverage them as a creative medium. SimInsights offers HyperSkill, a no-code tool to enable everyone to capture their knowledge in the form of 3D immersive, AI-powered simulations and share it with others. SimInsights team used HyperSkill to create Skillful, a growing collection of simulations to help anyone master any skill.